Shenzhen Siring Information Technology Co., Ltd. (Siring), founded in 1996, has dedicated 30 years to AI digitalization and IoT technology. With 100 employees and 90% in R&D roles, the company holds ISO27001, ISO9001, Double-Soft, and National High-Tech Enterprise certifications. Leveraging partnerships with the Shenzhen Institute of Big Data Research and other top universities, Siring masters the full technology stack: Java/GO/Python/Vue/Flutter, with complete full-chain development capabilities from chip-level to cloud.
I. Project Overview
This project focuses on integrated IoT embedded software and hardware development, covering PCBA design, microcontroller firmware development, wireless communication protocol integration, and smart terminal mass production delivery. Supporting mainstream chip platforms including STM32, ESP32, JieLi, and Rockchip, we provide high-reliability wireless smart solutions for smart home, industrial control, smart healthcare, automotive electronics, wearable devices, and more.
II. Core Chip Platform Support
STM32 Series (STMicroelectronics) Targeting industrial-grade high-reliability applications, supporting Cortex-M0/M3/M4/M7 cores, suitable for motor control, power monitoring, precision instruments, and other scenarios. Rich peripheral interfaces (ADC/DAC/CAN/ETH), supporting RTOS real-time operating systems and low-power modes.
ESP32 Series (Espressif) Integrated Wi-Fi 4/5 and Bluetooth 5.3 dual-mode communication, ideal for consumer IoT devices such as smart home, smart wearables, and wireless sensors. Supports Arduino, MicroPython, ESP-IDF development frameworks, with ultra-low-power sleep modes and rich GPIO expansion capabilities.
JieLi Chips (Zhuhai JieLi) Focused on audio and low-power Bluetooth solutions, widely used in TWS earphones, Bluetooth speakers, smart voice toys, and other products. Supports Bluetooth 5.3, LE Audio, multi-point connection, with high cost-performance ratio and rapid mass production advantages.
Rockchip Targeting high-end smart terminals and edge computing, supporting RK3566/RK3568/RK3588 AIoT chip platforms. Powerful NPU computing power (up to 6 TOPS), suitable for complex graphics and AI inference scenarios such as smart security, robotics, industrial tablets, and digital signage.
III. PCBA Hardware Development Capabilities
Schematic and PCB Design Supporting mainstream EDA tools including Altium Designer, Cadence, and PADS, with experience in multi-layer boards (4-12 layers), high-frequency high-speed design, and EMC/EMI optimization. Providing SI/PI simulation, thermal design analysis, and DFM manufacturability review.
Component Selection and Supply Chain Management Leveraging Shenzhen's complete electronics industry chain, establishing long-term stable chip agency channels to ensure stable supply and cost advantages for core components such as STM32, ESP32, JieLi, and Rockchip.
PCBA Prototyping and Mass Production Equipped with complete production lines including SMT mounting, DIP insertion, AOI inspection, X-RAY, and functional testing, supporting seamless scaling from 5 prototype boards to 1 million monthly production capacity. Providing value-added processes such as conformal coating, potting, and aging testing.
IV. Embedded Software Development
Firmware Development
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STM32: HAL/LL libraries, FreeRTOS, RT-Thread, bare-metal drivers
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ESP32: ESP-IDF, Arduino, MicroPython, Lua scripting
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JieLi: SDK secondary development, Bluetooth protocol stack customization, audio codec optimization
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Rockchip: Linux/Android system porting, BSP driver development, NPU model deployment
Wireless Communication Protocols
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Short-range: BLE 5.3, Mesh, Zigbee, Thread, Matter
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Local area: Wi-Fi 6, Ethernet, PLC power line carrier
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Wide area: NB-IoT, 4G Cat.1, 5G RedCap, LoRa
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Cloud integration: MQTT, CoAP, HTTP/2, WebSocket, TLS/SSL encryption
Edge Computing and AI Inference
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Rockchip NPU: Supports TensorFlow Lite, ONNX, Caffe model conversion and quantization
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STM32 AI: X-Cube-AI toolchain, enabling lightweight neural network deployment
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ESP32-S3: Vector instruction acceleration, supporting voice wake-up, image recognition, and other edge AI applications
V. Application Scenario Solutions
Smart Home Networking and interoperability for smart sockets, lighting control, environmental monitoring, security sensors, and other devices. Supports Matter/Thread protocols for cross-brand ecosystem compatibility.
Industrial IoT Equipment status monitoring, predictive maintenance, energy management, production line traceability, and other solutions. Supports industrial protocols such as Modbus, OPC UA, and CAN bus, with integration to MES/ERP systems.
Smart Healthcare Wearable health monitoring, medical device networking, pharmaceutical cold chain traceability, and more. Compliant with medical device electromagnetic compatibility standards, with FDA/CE certification support.
Automotive Electronics T-Box vehicle terminals, OBD diagnostics, tire pressure monitoring, smart cockpits, and more. Supports CAN/LIN bus, GNSS positioning, and 4G/5G remote communication.
Smart Audio TWS earphones, Bluetooth speakers, AI voice assistants, hearing aids, and more. Based on JieLi/Rockchip platforms, supporting active noise cancellation, spatial audio, and offline voice wake-up.
VI. Cloud and Application Layer Development
Device Management Platform Based on Spring Cloud microservices architecture, supporting million-level device concurrent access, providing device registration, OTA upgrades, remote diagnostics, rule engines, data visualization, and other functions.
Mobile Development
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APP: Native iOS/Android, Flutter cross-platform, React Native
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Mini Programs: WeChat, Alipay, TikTok, Baidu, and other multi-platform adaptation
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Management Backend: Vue3/Element Plus, data dashboards, BI reports
Data Security and Compliance
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Transmission encryption: TLS 1.3, national cryptography SM2/SM3/SM4
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Storage encryption: AES-256, database transparent encryption
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Privacy compliance: GDPR, Personal Information Protection Law, Level 2.0 Protection
VII. Project Delivery and Services
Development Process Requirements Analysis → Solution Design → Schematic Design → PCB Layout → Prototype Verification → Firmware Development → Cloud Integration → Small Batch Trial Production → Mass Production Import → Continuous Operation and Maintenance
Quality Assurance
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Hardware: ICT/FCT testing, temperature cycling, salt spray testing, ESD protection
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Software: Unit testing, integration testing, stress testing, penetration testing
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Certifications: CCC, SRRC, CE, FCC, RoHS, REACH
Service Commitments
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Average 60% budget savings and 70% shorter delivery cycles
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5-minute response, 24-hour repair, lifetime OTA upgrades
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100% on-time delivery, with optional source code licensing
VIII. Flagship Cases
Delivered core IoT modules for multiple industry leaders, covering smart appliance main control boards, industrial gateways, medical monitoring devices, automotive T-Box, TWS earphone main controls, and more, with cumulative shipments exceeding 10 million units.
Consecutive winner of the "Futian Elite Talent" team award, Siring is dedicated to commercializing embedded IoT research achievements, partnering with clients to capture the trillion-level wireless smart market.
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